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Multilayer ceramic capacitors
Array, C0G
Series/Type: Date:
Array February 2009
The following products presented in this data sheet are being withdrawn. Substitute Products: See www.epcos.com/withdrawal_mlcc Ordering Code B37940R5220K041 B37940R5220K043 B37940R5330K041 Substitute Product Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 Last Shipments 2010-12-31 2010-12-31 2010-12-31
(c) EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code B37940R5330K043 B37940R5470K041 B37940R5470K043 B37940R5101K041 B37940R5101K043 B37940R5221K041 B37940R5221K043 B37871R5100K041 B37871R5100K043 B37871R5150K041 B37871R5150K043 B37871R5220K041 B37871R5220K043 B37871R5330K041 B37871R5330K043 B37871R5470K041 B37871R5470K043 B37871R5101K041 B37871R5101K043 B37871R5221K041 B37871R5221K043 B37871R5331K041 B37871R5331K043 B37871R5471K041 B37871R5471K043 B37830R0100K021 B37830R0100K023 B37830R0150K021 B37830R0150K023 B37830R0220K021 B37830R0220K023 B37830R0330K021 B37830R0330K023 B37940R5100K041 B37940R5100K043 B37940R5150K041 B37940R5150K043
Substitute Product
Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26
Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30
Last Shipments 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.
Multilayer ceramic capacitors C0G
Array
Ordering code system
B37830
Type and size Chip size (inch/mm) = Temperature characteristic C0G: 0405/1012 B37830 0508/1220 B37940 0612/1632 B37871 X7R: 0405/1012 B37831 0508/1220 B37941 0612/1632 B37872 Internal coding "R" indicates array capacitor
R
0
101
K
0
2
1
Rated voltage 9 (Code) 16 VDC 0 (Code) 25 VDC 5 (Code) 50 VDC Capacitance, coded (example) 100 10 100 pF = 10 pF 101 10 101 pF = 100 pF 220 22 100 pF = 22 pF Capacitance tolerance J 5% K 10% (standard for C0G) M 20% (standard for X7R) Internal coding: 0 or decimal place for cap. value <10 pF 2 4 2-fold array 4-fold array Packaging 1 cardboard tape, 180-mm reel 3 cardboard tape, 330-mm reel
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Features Reduction of mounting time and mounting costs Space saving on the PCB Based on AEC-Q200 Rev-C Applications Suitable for electronic circuits with parallel line layout Coupling and filtering, particularly in RF circuits Resonant circuits Filter circuits Termination Nickel barrier terminations (Ni) for lead-free soldering Options Alternative capacitance values and tolerances available on request Delivery mode Cardboard and blister tape, 180-mm and 330-mm reel available Electrical data Temperature characteristic Climatic category Standard Dielectric Rated voltage Test voltage Capacitance range Temperature coefficient Dissipation factor Insulation resistance1) Insulation resistance1) Time constant1) Time constant1) Operating temperature range Ageing C0G 55/125/56 EIA Class 1 25, 50 2.5 VR/5 s 4.7 pF ... 1.0 nF 0 30 10-6/K < 1.0 10-3 > 105 > 104 > 1000 > 100 55 ... +125 none
(IEC 60068-1)
VR Vtest CR (limit value) (at +25 C) (at +125 C) (at +25 C) (at +125 C) tan Rins Rins Top
VDC VDC
M M s s C
1) For CR >10 nF the time constant = C
Rins is given.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Capacitance tolerances Code letter Tolerance J 5% K (standard) 10%
Dimensional drawing 2-fold array (case size 0405) 4-fold array (case sizes 0508 and 0612)
Dimensions (mm) 2-fold array Case size l w th k e u (inch) (mm) 0405 1012 1.37 0.15 1.00 +0/ 0.15 0.70 max. 0.36 0.10 0.64 0.20 0.10 4-fold array 0508 1220 2.00 0.20 1.25 0.15 0.85 0.10 0.30 0.10 0.50 0.10 0.20 +0.3/ 0.10 0612 1632 3.20 0.20 1.60 0.20 0.85 0.10 0.40 0.15 0.80 0.15 0.20 +0.3/ 0.10
Tolerances to CECC 32101-801
Please read Cautions and warnings and Important notes at the end of this document.
Page 4 of 15
Multilayer ceramic capacitors C0G
Recommended solder pad 2-fold array (case size 0405) 4-fold array (case sizes 0508 and 0612)
Recommended dimensions (mm) for reflow soldering Case size (inch/mm) 0405/1012 0508/1220 0612/1632 Type 2-fold array 4-fold array 4-fold array A 0.50 ... 0.55 0.50 ... 0.70 0.70 ... 0.90 B 0.45 ... 0.50 0.60 ... 0.70 0.80 ... 1.00 C 1.45 ... 1.60 1.60 ... 2.10 2.20 ... 2.80 D 0.30 ... 0.35 0.25 ... 0.35 0.30 ... 0.40 P 0.64 0.10 0.50 0.005 0.80 0.005
Termination
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Product range for array capacitors, C0G 2-fold arrays Size inch (l x w) mm (l x w) Type CR \ VR (VDC) 10 pF 15 pF 22 pF 33 pF 47 pF 100 pF 220 pF 330 pF 470 pF 0405 1012 B37830R 25 0508 1220 B37940R 50 4-fold arrays 0612 1632 B37871R 50
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Ordering codes and packing for C0G, 25 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel *1 pcs./reel 5000 5000 5000 5000 Cardboard tape, 330-mm reel *3 pcs./reel 20000 20000 20000 20000
CR
Ordering code
mm
Case size 0405, 25 VDC, 2-fold arrays 10 pF B37830R0100K02* 0.6 0.1 15 pF B37830R0150K02* 0.6 0.1 22 pF B37830R0220K02* 0.6 0.1 33 pF B37830R0330K02* 0.6 0.1
Please read Cautions and warnings and Important notes at the end of this document.
Page 7 of 15
Multilayer ceramic capacitors C0G
Ordering codes and packing for C0G, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel *1 pcs./reel 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 Cardboard tape, 330-mm reel *3 pcs./reel 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
CR
Ordering code
mm
Case size 0508, 50 VDC, 4-fold arrays 10 pF B37940R5100K04* 0.85 0.1 15 pF B37940R5150K04* 0.85 0.1 22 pF B37940R5220K04* 0.85 0.1 33 pF B37940R5330K04* 0.85 0.1 47 pF B37940R5470K04* 0.85 0.1 100 pF B37940R5101K04* 0.85 0.1 220 pF B37940R5221K04* 0.85 0.1 Case size 0612, 50 VDC, 4-fold arrays 10 pF B37871R5100K04* 0.85 0.1 15 pF B37871R5150K04* 0.85 0.1 22 pF B37871R5220K04* 0.85 0.1 33 pF B37871R5330K04* 0.85 0.1 47 pF B37871R5470K04* 0.85 0.1 100 pF B37871R5101K04* 0.85 0.1 220 pF B37871R5221K04* 0.85 0.1 330 pF B37871R5331K04* 0.85 0.1 470 pF B37871R5471K04* 0.85 0.1
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Typical characteristics1) Capacitance change C/C25 versus temperature T
Capacitance change C/C0 versus superimposed DC voltage V
Impedance |Z| versus frequency f
Dissipation factor tan versus temperature T
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Typical characteristics1) Insulation resistance Rins versus temperature T
Capacitance change C/C1 versus time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Cautions and warnings How to select ceramic capacitors Remember the following when selecting ceramic capacitors: 1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on AEC-Q200 Rev-C. 2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp 15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors should be connected in series. Alternatively a ceramic capacitor with integrated series circuits should be used in order to reduce the possibility of a short circuit caused by a fracture. The MLSC from EPCOS contains such a series circuit in a single component. 3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter "Effects on mechanical, thermal and electrical stress", section 1.4). 4. Additional stress factors such as continuous operating voltage or application-specific derating must be taken into account in the selection of components (refer to chapter "Reliability"). Recommendations for the circuit board design 1. Components with an optimized geometrical design are preferable where permitted by the application. 2. Use at least FR4 circuit board material. 3. Geometrically optimized circuit boards are preferable, especially those that cannot be deformed. 4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a circuit board. High bending forces may be exerted there when boards are separated and during further processing of a board (e.g. when incorporating it in a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit board. 6. Screw connections should not be used to fix a board or connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they should be cushioned, for instance using rubber pads.
Please read Cautions and warnings and Important notes at the end of this document.
Page 11 of 15
Multilayer ceramic capacitors C0G
Recommendations for processing 1. Ensure correct positioning of a ceramic capacitor on the solder pad. 2. Be careful when using casting, injection-molded and molding compounds and cleaning agents. They can damage a capacitor. 3. Support a circuit board and reduce placement forces. 4. Do not straighten a board (manually) if it is distorted by soldering. 5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or breaking). 6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or snap-in components) because of the danger of bending and fracture. 7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that components are not damaged. 8. Avoid excessive force when plugging a connector into a device soldered onto a board. 9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is permissible for them (see chapter "Soldering directions"). 10. When soldering, select the softest solder profile possible (heating time, peak temperature, cooling time) to avoid thermal stress and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement. 13. Ceramic capacitors with external silver-palladium terminations are intended for conductive adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors C0G
Symbols and terms Symbol A C C0 C1 CR C20 C25 C D Ea ESR F f fmeas fres Itest k L N Ploss Qel Q Rins RP RS SV T Tmeas Top Tref Ttest t tr ttest tan English Area Capacitance Initial (original) capacitance Capacitance value after one hour's use Rated capacitance Capacitance at 20 C Capacitance at 25 C Capacitance change Bending displacement Activation energy Equivalent series resistance Force Frequency Measuring frequency Self-resonant frequency Test current Ageing constant Inductance Quantity (integer values) Power dissipation or loss Electrical charge Quality Insulation resistance Parallel resistance Series resistance (circuit resistance) Rate of rise of a voltage pulse Temperature Measuring temperature Operating temperature Reference temperature Test temperature Time Rise time of a voltage pulse Test duration Dissipation factor German Flache Kapazitat Anfangskapazitat Kapazitatswert nach einer Stunde Nennkapazitat Kapazitat bei 20 C Kapazitat bei 25 C Kapazitatsanderung Durchbiegung Aktivierungsenergie Ersatzserienwiderstand Kraft Frequenz Messfrequenz Eigenresonanzfrequenz Prufstrom Alterungskonstante Induktivitat Anzahl (ganzzahliger Wert) Verlustleistung Elektrische Ladung Gute Isolationswiderstand Parallelwiderstand Serienwiderstand Flankensteilheit eines Spannungsimpulses Temperatur Messtemperatur Betriebstemperatur Bezugstemperatur Pruftemperatur Zeit Anstiegszeit eines Spannungsimpulses Prufdauer Verlustfaktor
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Please read Cautions and warnings and Important notes at the end of this document.
Multilayer ceramic capacitors C0G
Symbol V V0 Vmeas VR VS VRMS Vtest |Z| 0 r
English Voltage Initial (original) voltage (basic voltage level) Measuring voltage Rated voltage Amplitude of a voltage pulse Measuring (root-mean-square or effective) AC voltage Test voltage Magnitude of impedance (AC resistance) Temperature coefficient Absolute dielectric constant Relative dielectric constant Failure rate Time constant
German Spannung Anfangsspannung (Spannungsgrundpegel) Messspannung Nennspannung Hub des Spannungsimpulses Effektivspannung Prufspannung Betrag der Impedanz (Wechselstromwiderstand) Temperaturkoeffizient Absolute Dielektrizitatskonstante Relative Dielektrizitatskonstante Ausfallrate Zeitkonstante
Abbreviations / Notes Symbol English Lead spacing (in mm) Surface-mounted devices * + German Rasterma (in mm) Oberflachenmontierbares Bauelement
To be replaced by a number in ordering Platzhalter fur Zahl im Bestellnummerncodes, type designations etc. code oder fur die Typenbezeichnung. To be replaced by a letter. All dimensions are given in mm. The commas used in numerical values denote decimal points. Platzhalter fur einen Buchstaben. Alle Mae sind in mm angegeben. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte.
Please read Cautions and warnings and Important notes at the end of this document.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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